Custom TGV Glass Substrates | Through-Glass Via Solutions Provider

Author: admin Release date: 2025-06-10 14:01:30 Reading volume: 0

What is TGV (Through Glass Via) Glass Substrate?

TGV glass substrates are advanced interconnection materials that involve forming vertical through-holes (vias) directly in a glass wafer or panel. These substrates are crucial components in cutting-edge electronic and microelectronic packaging applications, especially in 3D integration, MEMS devices, RF modules, optoelectronic interconnects, microfluidics, and biosensors.

Key advantages of TGV substrates include:

Outstanding electrical insulation and thermal stability, ensuring reliable performance under demanding conditions.

Low dielectric constant, ideal for high-frequency signal transmission, reducing signal loss and cross-talk.

Excellent compatibility with heterogeneous integration and miniaturization, allowing seamless integration of multiple functions in ultra-compact designs.

At Lighting, we provide end-to-end TGV glass substrate customization and processing services tailored to the most demanding requirements of modern semiconductor and photonics applications.

Our TGV-Compatible Glass Materials

We supply and process a broad range of high-performance optical glass materials commonly used for TGV applications. Our selection includes both internationally renowned brands and domestic specialty glass, ensuring optimal material choice for your specific application.

Material Name	Thickness Range	Key Features
Borofloat® 33 (SCHOTT)	0.11mm – 10mm	Excellent thermal resistance, low thermal expansion, high chemical durability
SCHOTT B270	0.3mm – 6mm	High transparency and optical clarity, suitable for optoelectronic packaging

These glass types are meticulously selected for their dimensional stability, optical performance, and machinability, making them the ideal base materials for TGV structures across multiple domains.

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